Посетите веб-сайт компании Advantech, или выберите страну или регион ниже

Американский регион

  1. United States
  2. Brasil
  3. México
  4. Argentina
  5. Chile
  6. Colombia
  7. Perú

Европейский регион

  1. Europe
  2. Россия
  3. España

Азиатско-Тихоокеанский регион

  1. Australia
  2. 中国
  3. India
  4. Indonesia
  5. 日本
  6. 대한민국
  7. Malaysia
  8. Singapore
  9. 台灣
  10. ไทย
  11. Türkiye
  12. Việt Nam

Африка и Ближний Восток

  1. MENA

Регистрация в MyAdvantech

MyAdvantech является индивидуальным порталом для клиентов Advantech. Став членом Advantech, вы можете получать последние новости о продукции, приглашения на вебинар и специальные предложения интернет-магазина.

Зарегистрируйтесь прямо сейчас, чтобы получить быстрый доступ 24/7 к вашей учетной записи.

www.advantech.ru

Panel 0

Transbox

Panel 1

Transbox

Panel 2

Transbox

Panel 3

Transbox

Panel 4

Transbox

Panel 5

Transbox

COM-HPC

COM-HPC is the next-generation computer-on-module, defined with 800pin, two new 400pin board to board connectors. The increment of pin assignment for power input and I/O interface makes it possible to support more powerful computing unit, memory capacity up to 1TB; and upgrade bandwidth to support next generation high-speed interfaces, such as PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25Gb Ethernet. These features meet the growing demands for data processing and transmission. Coming with Server and Client pinout types, and five board sizes, COM-HPC is adaptable to the future use of edge computing in 5G network environment.

COM-HPC FF

COM-HPC Form Factor

COM-HPC comes with two types of interface schemes and 5 board sizes to serve different classes of embedded applications in the edge. COM-HPC Server is recommended to design with board size D & E, headless applications and 4~8pcs of long DIMM sockets for ultimate memory expansion, while COM-HPC Client is recommended to design with board size A, B & C, providing displays and can be integrated with 2 to 4 SODIMM sockets that relative low profile.

COM-HPC FF

COM-HPC Function Per Pinout

COM-HPC_2

COM-HPC vs. COM Express

COM-HPC offers large scale of form factors to complement spectrum of COM Express. It also provides more performance and super speed expansions for future I/O bandwidth. Refer to the comparison chart of board size and function support list.

Board size

COM-HPC enlarges board size, so that Size D and E can support 4~8pcs of long DIMM sockets that COM Express cannot realize because of physical limit. Here are the dimension comparison of COM-HPC and COM Express.

Function support list

Compared to COM Express, COM-HPC can support 65 lanes of PCI Express connectivity up to Gen5 (32GT/s) speed, 4 ports of USB4 (40Gbps) or USB 3.2 Gen 2x2 (20Gbps), 8 ports of 25GBase-KR with sideband signal and more low speed I/O pins for function communication.

Difference of the board to board connector

COM-HPC defines 800pin with two new designed 400pin board to board connectors for incremental pin assignment and optimized bandwidth; while COM Express defines one or two 220pin connectors for specific pinout types.

Quick Download